1 EDA Challenges and Options: Investing for the Future

"Overall, it is likely that a set of design cost driven challenges such as design productivity, power management, design for manufacturability, signal integrity, and reliability, will continue to dominate the EDA roadmaps."

Silicon technology complexity
driven challenges can be generally classified as:
--Leakage, power management, circuit/device
innovation, current delivery;
--Signal integrity analysis and management,
--Manufacturing variability
--Manufacturing handoff, NRE cost
--Scaling of global interconnect performance
relative to device performance.
--Decreased reliability ,electro-migration, SER,
fault-tolerance.

Challenges driven by system complexity [1] can be generally classified as:
--Reuse, hierarchical design, heterogeneous SOC
integration especially for mixed-signal
--Verification and test
--Cost-driven design optimization, co-optimization
at die-package-system levels
--Embedded software design, co-design with
hardware and for networked system
environments
-- Reliable implementation platforms, chip
implementation onto multiple circuit fabrics,
higher-level handoff to implementation
-- Design process management—design team size
and geographic distribution, data management,
collaborative design support.